[dsaen]

I have a transient model with a Solid-Solid interface for which I know the thermal contact conductance coefficient.

¿Is it possible to define the heat flow between solids using a convection-like formulation?

[MKuhn]

If you defined it as "Coupled Wall", that means you have wall and wall-shadow pair - yes. Then it is like in the attached picture and you can set the contact resistance in m² K /W.
In older versions of flunet you have to deal with a workaround defining an additional wall thickness between your solids which acts like an insulation.

[dsaen]

-- Never mind the comment below, it seems that the Contact Resistance option is only available with the Solidification model --

Are you aware of when they added this option (I have ANSYS 19)?
I do have a 'Coupled Wall', but I dont see that option. Am I doing something wrong?

[MKuhn]

Originally Posted by dsaen

-- Never mind the comment below, it seems that the Contact Resistance option is only available with the Solidification model --

Yes this is true

Originally Posted by dsaen

Are you aware of when they added this option (I have ANSYS 19)?
I do have a 'Coupled Wall', but I dont see that option. Am I doing something wrong?--

Maybe I was wrong and this option exist longer and I don't saw because I didn't use the Solidification model.


Try to switch on the solidification model. If you define the melting temperature in the material properties far away from your operation conditions, it will not affect the solution. Then try to define a large contact resistance and see if it works. In this case fluent consider also the thermal conductivity of the fluid enclosed between your solids.


Then try to do it with the proposed workaround. Define a certain wall thicknes which corrosponds to your

[contact resistance] = [wall thicknes / thermal conductivity of the solid]


Then compare the results. I'm curious about it.