[nazemi]

Hi,

I have started using ANSYS for some of my simulations and I do not know much about this software. I am trying to extract the thermal maps of a smartphone and I guess ANSYS Icepak is the best product to do so.

I have modeled the internal elements of the smartphone and I would like to fill the empty space with air, however, I have not been able to do it yet. What I am looking for is called Void Fill in Autodesk Inventor.
I was wondering if anyone knows how to fill the empty space with air. I also want to fill the inside of cabinet and outside of the smartphone with the same air.

I have the same problem in DesignModeler and cannot fill the empty space with air. I would really appreciate it if you help me solve this problem.

Thanks in advance,

[Jupudi.pramodh]

Hi Naz,
From the problem description you've provided, I assume the physics to be solved is Natural convection, Conduction & Radiation.

In this case, If you see your model tree, there's a cabinet object. which is nothing but your room domain. So, as long as the cabinet is ON & your object is inside the cabinet, You don't need to bother about Void fill, all empty spaces would be filled with working fluid (Air). Also in this case, you won't need to assign any heat transfer coefficient to the outer walls of the cellphone (your model), the solver will calculate the same through iterative process.

In case your cabinet object is off, You can fill the complete inside space of cell-phone enclosure with fluid block (block with fluid type and property assigned). And then bring in the inner components (PCB and other parts). Make sure you assign Least priority to Fluid block.

Hope this answers your query.

Regards,
Pramodh J

[nazemi]

Originally Posted by Jupudi.pramodh

Hi Naz,
From the problem description you've provided, I assume the physics to be solved is Natural convection, Conduction & Radiation.

In this case, If you see your model tree, there's a cabinet object. which is nothing but your room domain. So, as long as the cabinet is ON & your object is inside the cabinet, You don't need to bother about Void fill, all empty spaces would be filled with working fluid (Air). Also in this case, you won't need to assign any heat transfer coefficient to the outer walls of the cellphone (your model), the solver will calculate the same through iterative process.

In case your cabinet object is off, You can fill the complete inside space of cell-phone enclosure with fluid block (block with fluid type and property assigned). And then bring in the inner components (PCB and other parts). Make sure you assign Least priority to Fluid block.

Hope this answers your query.

Regards,
Pramodh J

Thanks a lot Pramodh. Your solution definitely works.

There is another workaround to solve this problem; one can use the enclosure and Boolean operation to find the inner volumes that are void. After that, it is possible to assign "Air" as the material of those volumes.

[Jupudi.pramodh]

Originally Posted by nazemi

Thanks a lot Pramodh. Your solution definitely works.

There is another workaround to solve this problem; one can use the enclosure and Boolean operation to find the inner volumes that are void. After that, it is possible to assign "Air" as the material of those volumes.

Hello Naz,
Good to hear back from you. Yeah that also is a workaround. It's similar to my option#2 and is actually more effective with capturing Void spaces.

regards,
Pramodh

[yanki]

Hello,

I think I have a similar problem and I was hoping you could help. I want to refine the mesh inside my cabinet where there is velocity fluctuations in the flow. Therefore, I want to create an assembly and use non-conformal mesh for that area. But, when I create a block object of type "fluid", the flow goes around that block as if it is type "solid" or has walls.

Am I doing something wrong here? Is there a way to refine mesh where the object is fluid?

Regards,
Yanki