I would like to simulate heat transfer from circuit board components to the air inside the case, then to the case, and finally to the air outside the case.

I think I would need to use buoyantFoam but I have no idea how to deal with the heat transfer from the air to the case or heat flow through the case.

Any suggestions?

[sradl]

Hi,

look at:
http://www.cfd-online.com/cgi-bin/Op...=3807#POST3807

You need basically for each phase (2 x air and solid) an own mesh. So things become a little complicated...

You can also use some kind of modified boundary condition. The choices you have are documented at:
http://openfoamwiki.net/index.php/HeatTransfer

br
Stefan Radl