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LTCC(Low Temperature Co-fired Ceramic) substrate simulation |
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October 28, 2009, 01:25 |
LTCC(Low Temperature Co-fired Ceramic) substrate simulation
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Vineeth
Join Date: Oct 2009
Location: Bangalore
Posts: 1
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Dear all,
I have to analyse a LTCC substrate. I need to find the thickness of Dielectric material after Co-firing of LTCC with metal layers. LTCC (Low Temperature Co-fired Ceramic) material is fired with Metal Layers (Silver) at a Temperature of 850 C and Pressure at Top and Bottom surfaces (350 Kg/cm2) The Layer stack-up (Dielectric - 25 microns and Metal Layer - 15 microns) The entire thickness of the Stack-up before firing is 145 microns and after firing is 100 microns. I need to simulate with these Boundary conditions and predict the Dielectric thickness(deformation) after Firing (Pressure and Temperature Boundary conditions) The side surfaces are fixed support. Metal and Dielectric dimensions (4 x 4 mm) 50 % Metal presence Kindly help me in this regard. Regards, Vineeth |
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