[nomi.tahir]

I am using RPI Wall Boiling Model and following Wall Boiling Tutorial. But I am unable to find the details of few expressions being used in the subcooled boiling case. Kindly if someone knows the detail about these expressions please help me. If these are correlations kindly let me know the correlation. The expressions are as follows:

Tsub1 = -5.0 [K]
Tsub2 = 13.5 [K]
TsubMean = 0.5*(Tsub1+Tsub2)
TsubScale = 4.0[K]
SaturTemper = 530.65 [K]
TsubL = SaturTemper-Liquid.T
TanhArgum = (TsubL-TsubMean)/TsubScale
TanhBlend = 1.0/(1.0+exp(TanhArgum))
diam2 = 0.15E-3 [m]
diam1 = 2.00E-3 [m]
BubbleDiam = TanhBlend*(diam1-diam2)+diam2

ArDen1 = 6.0 * max(Vapour.vfc,MinVFforArea) / BubbleDiam
MaxVFforArea = 0.8
ArDen1Max = 6.0 * MaxVFforArea / BubbleDiam
ArDen2 = ArDen1Max * max(1.0-Vapour.vfc,MinVFforArea) / (1.0-MaxVFforArea)
BlendArDen = -2.0
AreaDensity = (ArDen1^BlendArDen + ArDen2^BlendArDen)^(1.0/BlendArDen)