[hyeunsu]

Hello!

I am a mechanical engineer and recently I have been working with more CFD but most of my knowledge has been from Youtube videos and university years ago. The past half year or so I have been reviewing and practicing on ANSYS Fluent and CFX and can do relatively simple problems with no problem.

However, I can't seem to figure out how to set up and run (getting good results) this problem.
I have a completely sealed electronics box with components inside. The system consists of 5 copper chips each generating about 50W of heat, attached to a PCB board, which is attached to a backplane. The heat inside of the box is transferred through the chassis by conduction and natural convection to then be cooled by forced convection of air flowing over the box.

I have tried setting up with laminar flow with an enclosure around the closed box with inlets in the sides of air (0.05 m/s) and outflow outlet. I have also tried with filling in the air within the sealed box as a seperate fluid (air) and I seem to have problems with starting Fluent or getting unrealistic results (such as 4000K).

If there is any guidance or comments please let me know! Thank you!