[gbartolome]

I am doing thermal analysis on a PCB for a senior design project. I used ansys icepak, but I think that the model output/analysis is incorrect given the high temperature on only 1 resistor. The temperature distribution looks incorrect is what I am saying. The PCB is an inverter with 5V running through it.

My question is do traces generate a lot of heat in PCBs? If so, is it enough to need to put into an ANSYS Icepak model? How do I do so from Eagle Autodesk STEP file or.brd file? How do I make my model better? How do I ensure my model is converging on a solution? If I use a thermocouple to see the power dissipation on each component, can I change the power dissipation on my model in order for it to be more accurate?