WEBINAR: Thermal Modeling Approaches for Printed Circuit Boards (PCBs)

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WEBINAR: Thermal Modeling Approaches for Printed Circuit Boards (PCBs)

Posted By:	Brigid Blaschak
Date:	Thu, 12 Nov 2015, 7:06 p.m.

WHEN: December 10, 2015

This seminar will examine the main methodologies for modeling printed circuit boards in thermal simulations of electronic assemblies. The methods vary from fully- detailed models that resolve all the traces to a simplified geometric model with averaged properties. Each method will be described and demonstrated, and the advantages and disadvantages of each approach will be detailed.

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