United Kingdom, April 24, 2013
Do your designs involve the packaging of electronics within
a confined space, potentially leading to thermal management
problems? Join our free webinar outlining modern methods
used to predict and optimise the thermal performance of
electronic systems, including how this can support
reliability qualification.
Description:
In addition to the typical requirement faced by engineers
to package electronic components and systems into
increasingly small enclosures, avoiding failure and
detrimental performance due to overheating is particularly
challenging when:
* Other considerations preclude the use of fans and place
restrictions on grille design
* Your rack-mounted module is competing for air flow in a
crowded chassis
* You need to design against fan outage
Computational fluid dynamics (CFD) is an invaluable
technique to quantify component temperatures and visualise
air flow. ANSYS Icepak is a CFD-based simulation tool
specifically designed for the electronics industry,
enabling engineers to maximise the use of available air
flows and keep temperature-sensitive components within an
acceptable envelope.
Agenda
* Wilde Analysis within the electronics industry
* How can simulation save costs and add value?
* Overview of ANSYS Icepak
* Applications
o Heat sink and cooling fan selection and sizing
o Layout optimisation
o Performance in working environments
o Supporting reliability analysis
* Q&A Session
Who Should Attend
* Mechanical Design Engineers and Managers involved in
Electronics packaging
* Electrical/Electronics Designers
* Reliability Engineers
* Project Managers
Registration / Further Information
Simply choose one of the following options to reserve your
free place:
* Complete the registration form on our website
* Call us on +44 (0)161 4747479
* Email us at events@wildeanalysis.co.uk
To find out more about our software and services,
please contact us on +44 (0) 161 4747479 or email
events@wildeanalysis.co.uk
