Flow Science, Inc. announces the release of a new product, FLOW-3D ThermoSET, the first CAE package aimed specifically at solving the complex and unique problems surrounding the development and production of products using thermosetting resins.

Thermosetting resins, with their high adhesive and structural strength and thermal and chemical durability, are used in semiconductor devices, generators, transformers and switches, coils and other components for electric vehicles and hybrid electric vehicles, printed circuit boards, and MRIs. These materials present unique and challenging problems in the production process, which FLOW-3D ThermoSET will help engineers overcome.

Working with Hitachi Corporation and Terrabyte Corporation of Japan, which collaborated on the development of this customized version of FLOW-3D, Flow Science can now offer engineers seeking to tackle these most difficult problems an advanced tool to produce accurate predictions of void formations, incomplete filling, overfilling, and gold wire deformations.

“FLOW-3D ThermoSET has been used in the electronics industry in Japan for over 5 years with great success,” said Thomas Jensen, President of Flow Science, “and now we are opening the release to a worldwide audience.”