ANSYS Simulation Webinars - May and June 2010

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ANSYS Simulation Webinars - May and June 2010

Posted By:	Chris Cowan
Date:	Tue, 27 Apr 2010, 11:54 p.m.

Ozen Engineering, Inc. announces their ANSYS Simulation Webinar Series schedule for May and June of 2010. These technical seminars will be offered free of charge to the engineering community. The objective of the webinars is to increase attendees’ familiarity and competence in using finite element analysis to advance product development. Technical seminars are held online every Tuesday and Thursday from 9-10AM PST.

Fluid Mechanics and CFX - Apr. 29th @ 9-10am PT

Heat Transfer in ANSYS Mechanical - May 6th @ 9-10am PST

Electronic Enclosure Simulation with ANSYS Icepak - May 13th @ 9-10am PST

Semiconductor Package Simulation: Solder Joint Reliability & Moisture - May 20th @ 9-10am PST

Autodesk Moldflow User Group Meeting - May 27th @ 10-3pm PST

Injection Molding and Product Performance Simulation – June 3rd @ 9-10am PST

Realistic Medical Device Implant Simulation – June 10th @ 9-10am PST

ANSYS Mechanical Dynamics – June 17th @ 9-10am PST

Nitinol Shape-Memory Alloy Simulation in ANSYS – June 24th @ 9-10am PST

Schedule of Technical Webinars

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