Web Seminar: Accurate Component Junction and Case Temperature

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Web Seminar: Accurate Component Junction and Case Temperature

Posted By:	Debbie Searle
Date:	Fri, 27 Nov 2009, 11:52 a.m.

Web Seminar: Accurate Component Junction and Case Temperature Wednesday 16th December 4pm US/Eastern 9pm UK/London

As the drive for smaller and faster products increases, the thermal engineer is continually pushed to create effective heat removal designs. The thermal performance of electronic components is an important consideration during this design process. How to model the components effectively while minimizing computational effort and maximizing useful accurate results is a balancing act that many thermal engineers will be familiar with. There are many reasons for thermally characterizing an IC and many methods to do so.

This web seminar will discuss why it is useful to characterize the thermal properties of a component and what modeling methods are available. The pros and cons of the different methods and in what situations they may be appropriate will also be covered.

Register Here

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