Nov 18, 2009 1:00 PM - 2:00 PM US/Eastern

As the power density of electronics devices go up, so does the need for chip and system thermal management. One way to cool the components down is to add a heat sink. Heat sinks uses conduction, convection and sometimes radiation to enhance the heat transfer from a hot surface to a cooler fluid. Many factors such as cost, manufacturability and weight need to be considered when choosing a heat sink. How the heat sink gets attached to the component is also critical.

During this 45 minute presentation, we will focus on how heat sinks work and how to design a heat sink while considering all the critical factors such as size, airflow, cost and attachment methods. We will also investigate how, using simulation, the heat sink design could be optimized and validated in the application environment. Engineers involved in board and chassis design would find this session very educational.