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CFD Events Calendar, Event Record #20364

Thermal Characterization of Electronic Components & Systems
Spend the day with us learning about our measurement system for the fast and very accurate thermal characterization of electronic components and systems (IC packages, MOSFETS, IGBTs, etc.) You will also experience hands-on practical exercises with the T3Ster Measurement System. This one day event is offered free of charge. Complimentary refreshments and lunch are provided.
Date: June 4, 2014
Location: Mentor Graphics (Deutschland) GmbH, Zettachring 4, D-70567 , Stuttgart, Germany
Web Page:
Organizer: Mentor Graphics (Deutschland) GmbH
Application Areas: Electronics Cooling, Automotive, Aerospace, Semiconductor Processing, General CFD, Computer Aided Design (CAD)
Type of Event: Seminar, Local

Information Day - System Level Thermal Testing - 
Measurement Methodology

Event dates, location and topic:

4 June 2014, Stuttgart: Power Electronics Reliability? 
Start testing now, 1500A for a longer life

11 June 2014, Frankfurt: T3Ster can make your cars better: 
Thermal testing in the Automotive Industry

16 September 2014, Stuttgart: Optimize your design flow: 
Thermal Characterization & Simulation

16 October 2014, Stuttgart: Can not rely on vendor data? 
Test Thermal Interface Materials with DynTIM

29 October 2014, Frankfurt: Optical data for thermal 
simulation: The T3Ster-FloEFD solution

27 November 2014, Stuttgart: IGBT Reliability: 1500A closer 
to solving your problems
Event record first posted on May 7, 2014, last modified on May 10, 2014

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