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| Understanding the thermal impedances in power LED applications | |
| Thermal impedance is dynamic property of any semiconductor package. In simple words, it describes how long does it takes for an encapsulated chip to heat up to the steady- state value of the junction temperature when the power is abruptly switched on or how long it takes for the chip to cool down to the ambient temperature when the power is switched on. | |
| Date: | July 27, 2011 |
| Location: | http://www.mentor.com/products/mechanical/events/led-applications-webinar |
| Organizer: | Mentor Graphics |
| Softwares: | FloVENT, EFD (Engineering Fluid Dynamics), FloEFD |
| Type of Event: | Online Event, International |
| Description: | |
Understanding the thermal impedances in power LED applications July 27, 2011 10am London / 11am Europe / 2pm US-Eastern Thermal impedance is dynamic property of any semiconductor package. In simple words, it describes how long does it takes for an encapsulated chip to heat up to the steady- state value of the junction temperature when the power is abruptly switched on or how long it takes for the chip to cool down to the ambient temperature when the power is switched on. Also, the steady-state value of the thermal impedance determines the temperature change of the junction due to the applied power step. To register, click here |
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| Event record first posted on July 14, 2011, last modified on July 21, 2011 | |
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