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CFD Events Calendar, Event Record #13871

Testing Thermal Interface Material (TIM) Analysis
This on-line presentation will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained.
Date: March 10, 2011
Contact Email:
Organizer: Mentor Graphics
Application Areas: Electronics Cooling
Type of Event: Online Event, International

The presentation will begin with an overview of the 
existing industrial and experimental test methods aimed at 
measuring the thermal conductivity of these materials.  The 
ASTM D-5470 steady state TIM testing standard will then be 
explained and evaluated. 

In the second part of the presentation newly developed test 
setups will be shown which mean an enhancement to the 
existing standard, including a possible in-situ solution.  
These new approaches will be explained in detail and 
measurement results will be shown. 

In the final part of the presentation the presenter will 
discuss the importance of the evaluation of long term 
reliability of these materials beside the highly precise 
measurement of their thermal conductivity.
Event record first posted on February 16, 2011, last modified on February 17, 2011

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