Web Seminar:  Accurate Component Junction and Case 
Temperature<br>
Wednesday 16th December<br>
4pm US/Eastern<br>
9pm UK/London<br><br>

As the drive for smaller and faster products increases, the 
thermal engineer is continually pushed to create effective 
heat removal designs. The thermal performance of electronic 
components is an important consideration during this design 
process. How to model the components effectively while 
minimizing computational effort and maximizing useful 
accurate results is a balancing act that many thermal 
engineers will be familiar with. There are many reasons for 
thermally characterizing an IC and many methods to do so. 
<br><br>

This web seminar will discuss why it is useful to 
characterize the thermal properties of a component and what 
modeling methods are available. The pros and cons of the 
different methods and in what situations they may be 
appropriate will also be covered.